ATOCK’s
Ultra-thin film polishing
High precision parallel plane polishing
Ultra-fine processing
Welding

<p>ATOCK’s<br />
Ultra-thin film polishing<br />
High precision parallel plane polishing<br />
Ultra-fine processing<br />
Welding</p>

Only the introduction of the facility, there is a limit to the quality and accuracy.
Years of experience, extensive know-how, flexible idea is realized fused,
we are skillful at ultra-thin film polishing processing technology and ultra-fine processing technology and welding technology.
From design and development stage on the basis of the drawings,
we will consult to customer request.

Polishing

  • Polishing of Ultra-thin Film Quartz

    Thickness quartz of 8μm(~φ20)
    Total thickness of 10 to 20μm after multi layer vapor deposition

    《Applications》

    X-ray equipment parts for structural analysis
    Cover Glass for Laser
    Quartz Oscillator

  • High precision parallel plane polishing

    Thickness allowance ±1μm(~φ100)

    《Applications》

    Substrate for film Coating
    Evaluation Substrate for Measurement
    Quartz glass substrate for light transmission

  • Large Diameter Grinding and Polishing

    ~φ3000 (2142mm sq.)

    《Applications》

    SiO2 Targets
    Large-Sized Boards
    Large equipment for the observation window

Grinding

  • High-precision cylinder Lapping and polishing

    ~φ500
    ~3100l

    《Applications》

    Parent Materials for Quartz Fiber
    Light Guides
    Target Rods
    Polarization beam splitter

Hole Opening

  • High precision Hole Opening and Polishing

    φ0.1mm~

    《Applications》

    Shower plate
    Flow cell
    Quartz cell

  • Rod manufacturing

    φ0.4mm~

    《Applications》

    optical fiber
    Rod for optical and research

  • Plate manufacturing

  • Laser Processing

Welding

  • Quartz Glass Welding

    《Applications》

    Various jig to be used in the semiconductor and liquid crystal manufacturing process
    (Quartz Boat, Quartz Plate, Quartz Tubes, Quartz Carrier, Quartz Box)

Reclaim

  • Reclaim processing and polishing of circuit board

  • Size down process

    《Applications》

    Size down of the silicon wafer
    Chips of various wafer

  • Welding repair process

Coating

  • Coating

  • Coating

Other processing

  • integrated processing

  • integrated processing