Only the introduction of the facility, there is a limit to the quality and accuracy.
Years of experience, extensive know-how, flexible idea is realized fused,
we are skillful at ultra-thin film polishing processing technology and ultra-fine processing technology and welding technology.
From design and development stage on the basis of the drawings,
we will consult to customer request.
Polishing
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Polishing of Ultra-thin Film Quartz
Thickness quartz of 8μm(~φ20)
Total thickness of 10 to 20μm after multi layer vapor deposition《Applications》X-ray equipment parts for structural analysis
Cover Glass for Laser
Quartz Oscillator -

High precision parallel plane polishing
Thickness allowance ±1μm(~φ100)
《Applications》Substrate for film Coating
Evaluation Substrate for Measurement
Quartz glass substrate for light transmission -

Large Diameter Grinding and Polishing
~φ3000 (2142mm sq.)
《Applications》SiO2 Targets
Large-Sized Boards
Large equipment for the observation window
Grinding
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High-precision cylinder Lapping and polishing
~φ500
~3100l《Applications》Parent Materials for Quartz Fiber
Light Guides
Target Rods
Polarization beam splitter
Hole Opening
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High precision Hole Opening and Polishing
φ0.1mm~
《Applications》Shower plate
Flow cell
Quartz cell -

Rod manufacturing
φ0.4mm~
《Applications》optical fiber
Rod for optical and research -

Plate manufacturing
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Laser Processing
Welding
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Quartz Glass Welding
《Applications》Various jig to be used in the semiconductor and liquid crystal manufacturing process
(Quartz Boat, Quartz Plate, Quartz Tubes, Quartz Carrier, Quartz Box)
Reclaim
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Reclaim processing and polishing of circuit board
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Size down process
《Applications》Size down of the silicon wafer
Chips of various wafer -

Welding repair process
Coating
Other processing
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integrated processing
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integrated processing


